Metallic Solder Paste 15g for PCB/SMD/BGA/PGA

Solder Paste (Mixture of tin alloy powder & paste flux) for repairing electronic boards, PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances by using tin soldering iron, hot air soldering station and SMT/BGA rework station. Specification: • Particle Size:30-45 Micron. • Alloy: Sn63/Pb37. • Melting Point: 185-240 Celsius. Features: • Suitable to stencil printing (holes larger than 0.45mm). • Good conductivity and oxidation resistance. • High purity, stable viscosity and soft soldering. • Bright and full solder joints. • No residue solid after rework and easy cleaning. • Halogen free. • 65% Metal Content. Usage: • Repairing electronic boards such as PCB/SMD/BGA/PGA for PCs, Laptops, Smartphones, playstation, Satellite Receiver and all sensitive electronic appliances. • Reballing BGA chipset with reballing stencil (holes larger than 0.45mm). • Repairing phones, as well as replacement SMD component, micro switches and charging connectors. • Soldering electrical control boards. • Soldering all copper alloys, wires, lithium ion batteries and solderable surfaces as nickel strips. Usage Recommendations (very important): • Follow safety precautions & notes. • Clean the surface (Clear any residues or dust). • Put a very little bit of solder paste before soldering. • Use a suitable soldering iron tip with the target area. • Use a suitable soldering iron with the target size. • Use a suitable soldering station with the target component. • Use a wet soldering sponge for cleaning the tip and during soldering. • Use thinner or any alcohol for cleaning. Notes: • For best results, follow the usage recommendations. • Don’t put soldering iron tip in the solder paste. • Not suitable with welding by fusion or flame. Safety Precautions: • Close after using & keep away from children. • Use enough water when eyes or wounds are touched. Appearance: The solder paste is a soft paste, packaged in a round plastic can – net weight 15g.